전자 부품 : MR18R162GAF0

제조 업체 : Samsung semiconductor

포장 :

핀을 :

설명 : (MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die

온도 : 분 °C | 맥스 °C

Datasheet : MR18R162GAF0 PDF

• MR18R16224DF0
• MR18R16228DF0
• MR18R1622AF0
• MR18R1622AF0-CK8
• MR18R1622AF0-CM8
• MR18R1622DF0
• MR18R1622GDF0
• MR18R16248EG0
• MR18R1624AF0
• MR18R1624AF0-CK8
• MR18R1624AF0-CM8
• MR18R1624AF1-CN9
• MR18R1624AF1-CT9
• MR18R1624EG0-CK8
• MR18R1624EG0-CM8