전자 부품 : MR18R1624AF1-CT9

제조 업체 : Samsung semiconductor

포장 :

핀을 :

설명 : (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

온도 : 분 °C | 맥스 °C

Datasheet : MR18R1624AF1-CT9 PDF

• MR18R1624AF0
• MR18R1624AF0-CK8
• MR18R1624AF0-CM8
• MR18R1624AF1-CN9
• MR18R1624AF1-CT9