전자 부품 : K4H1G0838M-LB3

제조 업체 : SAMSUNG[Samsung semiconductor]

포장 :

핀을 :

설명 : M-die SDRAM Specification TSOP-II with Pb-Free (RoHS compliant)

온도 : 분 °C | 맥스 °C

Datasheet : K4H1G0838M-LB3 PDF

• K4H1G0838A
• K4H1G0838A-TCA0
• K4H1G0838A-TCA2
• K4H1G0838A-TCB0
• K4H1G0838A-TLA0
• K4H1G0838A-TLA2
• K4H1G0838A-TLB0
• K4H1G0838A-UC/LA2
• K4H1G0838A-UC/LB3
• K4H1G0838A-UC/LCC
• K4H1G0838A-UCLA2
• K4H1G0838A-UCLB3
• K4H1G0838A-UCLCC
• K4H1G0838AUC/LB0
• K4H1G0838AUCLB0